Købe 0233003.MXP med BYCHPS
Køb med garanti
0233003.MXP
- Varenummer:
- 0233003.MXP
- Fabrikant:
- Littelfuse
- Beskrivelse:
- FUSE GLASS 3A 125VAC 5X20MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17083 Pieces
- Datablad:
- 0233003.MXP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0233003.MXP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0233003.MXP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 125V |
| Størrelse / Dimension: | 0.205" Dia x 0.787" L (5.20mm x 20.00mm) |
| Serie: | 233 |
| Responstid: | Medium |
| Emballage: | Bulk |
| Pakke / tilfælde: | 5mm x 20mm |
| Andre navne: | 0233003.MXP-ND 0233003MXP 233003 233003.P F4708 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Holder |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Smeltning I²t: | 26.24 |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | 0233003.MXP |
| Sikringstype: | Cartridge, Glass |
| Beskrivelse: | FUSE GLASS 3A 125VAC 5X20MM |
| DC Cold Resistance: | 0.0431 Ohm |
| Nuværende vurdering: | 3A |
| Farve: | - |
| Brydeskapacitet @ Nominel spænding: | 10kA |
| Godkendelser: | CE, CSA, KC, PSE, UL |
| Email: | [email protected] |
Relaterede dele til 0233003.MXP
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers