Købe 0LCC2 med BYCHPS
Køb med garanti
0LCC2
- Varenummer:
- 0LCC2
- Fabrikant:
- Littelfuse
- Beskrivelse:
- FUSE ACS CLIP CLAMP 60A 250/600V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12574 Pieces
- Datablad:
- 0LCC2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0LCC2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0LCC2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | - |
|---|---|
| Andre navne: | LCC2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | 0LCC2 |
| Til brug med / relaterede produkter: | Fuse and Clip |
| Beskrivelse: | FUSE ACS CLIP CLAMP 60A 250/600V |
| Tilbehørstype: | Clamp |
| Email: | [email protected] |
Relaterede dele til 0LCC2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
0LCC8 | Littelfuse Inc. | FUSE ACS CLIP CLMP 600A 250/600V | Forespørgsel |
|
LRUJ13 | Littelfuse Inc. | FUSE REDUCER CLASS J 100 TO 30A | Forespørgsel |
|
275.5325.0002 | Littelfuse Inc. | BLOCK HOLDER COVER BF2 (MEGA) | Forespørgsel |
 |
2A1630-12 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
0LCC4 | Littelfuse Inc. | FUSE ACS CLIP CLAMP 60A 600V | Forespørgsel |
|
00-001-218-27/J | Eaton | PLASTIC | Forespørgsel |
|
0LCC6 | Littelfuse Inc. | FUSE ACS CLIP CLMP 200A 250/600V | Forespørgsel |
|
0LCC5 | Littelfuse Inc. | FUSE ACS CLIP CLMP 100A 250/600V | Forespørgsel |
|
02400105Z | Littelfuse Inc. | RESISTOR ATO 10K OHM 0.25W | Forespørgsel |
|
GV2G445A46 | Eaton | FUSEHOLDER BUSS BAR | Forespørgsel |
|
10613-64004 | Eaton | TERMINAL BLOCK ASSY. | Forespørgsel |
|
0LCC7 | Littelfuse Inc. | FUSE ACS CLIP CLMP 400A 250/600V | Forespørgsel |
|
0LCC1 | Littelfuse Inc. | FUSE ACS CLIP CLAMP 30A 250V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers