Købe 0ZCJ0075FF2E med BYCHPS
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0ZCJ0075FF2E
- Varenummer:
- 0ZCJ0075FF2E
- Fabrikant:
- Bel Fuse, Inc.
- Beskrivelse:
- PTC RESTTBLE 0.75A 6V CHIP 1206
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17574 Pieces
- Datablad:
- 0ZCJ0075FF2E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0ZCJ0075FF2E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0ZCJ0075FF2E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Maks: | 8V |
|---|---|
| Type: | Polymeric |
| Tid til tur: | 200ms |
| Tykkelse (Max): | 0.049" (1.25mm) |
| Størrelse / Dimension: | 0.128" L x 0.065" W (3.25mm x 1.65mm) |
| Serie: | 0ZCJ |
| Modstand - Post Trip (R1) (Max): | 290 mOhm |
| Modstand - Initial (Ri) (Min): | 90 mOhm |
| Modstand - 25 ° C (Typ): | - |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1206 (3216 Metric), Concave |
| Andre navne: | 507-1804-2 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 2A (4 Weeks) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | 0ZCJ0075FF2E |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Udvidet beskrivelse: | PTC Resettable Fuse 8V Ih Surface Mount 1206 (3216 Metric), Concave |
| Beskrivelse: | PTC RESTTBLE 0.75A 6V CHIP 1206 |
| Nuværende - tur (it): | 1.5A |
| Nuværende - Maks: | 100A |
| Nuværende - Hold (Ih) (Max): | 750mA |
| Godkendelser: | cURus, TUV |
| Email: | [email protected] |
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|---|---|---|---|---|
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers