Købe 10SVP560M med BYCHPS
Køb med garanti
10SVP560M
- Varenummer:
- 10SVP560M
- Fabrikant:
- Panasonic
- Beskrivelse:
- CAP ALUM POLY 560UF 20% 10V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15035 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 10SVP560M, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 10SVP560M via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 10V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.406" L x 0.406" W (10.30mm x 10.30mm) |
| Størrelse / Dimension: | 0.394" Dia (10.00mm) |
| Serie: | OS-CON™, SVP |
| Ripple Current - Lavfrekvens: | 261.5mA @ 120Hz |
| Ripple Current - High Frequency: | 5.23A @ 100kHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial, Can - SMD |
| Andre navne: | P16438TR |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 10SVP560M |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | 0.500" (12.70mm) |
| Udvidet beskrivelse: | 560µF ±20% 10V Aluminum Polymer Capacitor Radial, Can - SMD 13 mOhm 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 13 mOhm |
| Beskrivelse: | CAP ALUM POLY 560UF 20% 10V SMD |
| kapacitans: | 560µF |
| Applikationer: | - |
| Email: | [email protected] |
Relaterede dele til 10SVP560M
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers