Købe 1422006-5 med BYCHPS
Køb med garanti
1422006-5
- Varenummer:
- 1422006-5
- Beskrivelse:
- RELAY GEN PURP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14732 Pieces
- Datablad:
- 1422006-5.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 1422006-5, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 1422006-5 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | V23079G2008X079 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 17 Weeks |
| Producentens varenummer: | 1422006-5 |
| Udvidet beskrivelse: | Relay |
| Beskrivelse: | RELAY GEN PURP |
| Email: | [email protected] |
Relaterede dele til 1422006-5
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
1422002-8 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
 |
1422037-2 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 3A 12V | Forespørgsel |
|
1422006-1 | TE Connectivity Potter & Brumfield Relays | V23079G2001X071 | Forespørgsel |
|
1422015-9 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
|
1422007-6 | TE Connectivity Potter & Brumfield Relays | V23079E2219B301 | Forespørgsel |
|
1422006-4 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
|
1422007-5 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
|
1422007-8 | TE Connectivity Potter & Brumfield Relays | V23079E2208B301 | Forespørgsel |
|
1422036-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
|
1422015-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Forespørgsel |
|
1422002-9 | TE Connectivity Potter & Brumfield Relays | V23079B2201B301 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers