Købe 226AVG100MFBJ med BYCHPS
Køb med garanti
226AVG100MFBJ
- Varenummer:
- 226AVG100MFBJ
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP ALUM POLY 22UF 20% 100V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19664 Pieces
- Datablad:
- 226AVG100MFBJ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 226AVG100MFBJ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 226AVG100MFBJ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 100V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 0.315" Dia (8.00mm) |
| Serie: | AVG |
| Ripple Current - Lavfrekvens: | 92.5mA @ 120Hz |
| Ripple Current - High Frequency: | 1.85A @ 100kHz |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 226AVG100MFBJ |
| Levetid @ Temp.: | 2000 Hrs @ 125°C |
| Blyafstand: | 0.138" (3.50mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 0.532" (13.50mm) |
| Udvidet beskrivelse: | 22µF ±20% 100V Aluminum Polymer Capacitor Radial, Can 9.0429 Ohm 2000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 9.0429 Ohm |
| Beskrivelse: | CAP ALUM POLY 22UF 20% 100V T/H |
| kapacitans: | 22µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 226AVG100MFBJ
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers