Købe 255PSB122K4R med BYCHPS
Køb med garanti
255PSB122K4R
- Varenummer:
- 255PSB122K4R
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP FILM 2.5UF 1.2KVDC RAD 4LD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19106 Pieces
- Datablad:
- 255PSB122K4R.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 255PSB122K4R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 255PSB122K4R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 1200V (1.2kV) |
|---|---|
| Spændingsbedømmelse - AC: | 500V |
| Tolerance: | ±10% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 2.264" L x 1.378" W (57.50mm x 35.00mm) |
| Serie: | PSB |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial - 4 Leads |
| Driftstemperatur: | -40°C ~ 100°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | 255PSB122K4R |
| Blyafstand: | 2.067" (52.50mm) |
| Højde - Siddende (Max): | 1.969" (50.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 2.5µF ±10% Film Capacitor 500V 1200V (1.2kV) Polypropylene (PP), Metallized Radial - 4 Leads |
| ESR (Equivalent Series Resistance): | 2.2 mOhm |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 2.5UF 1.2KVDC RAD 4LD |
| kapacitans: | 2.5µF |
| Applikationer: | High Frequency, Switching; High Pulse, DV/DT; Snubber |
| Email: | [email protected] |
Relaterede dele til 255PSB122K4R
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers