Købe 27E895 med BYCHPS
Køb med garanti
27E895
- Varenummer:
- 27E895
- Beskrivelse:
- SOCKET DINRAIL W/SCREW TERM K10
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 20100 Pieces
- Datablad:
- 27E895.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 27E895, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 27E895 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Screw Terminal |
| Serie: | K10 |
| Andre navne: | 2-1419106-7 PB332 |
| Antal positioner: | 8 |
| Monteringstype: | DIN Rail |
| Fabrikantens standard ledetid: | 7 Weeks |
| Producentens varenummer: | 27E895 |
| Til brug med / relaterede produkter: | K10 Series |
| Funktioner: | - |
| Udvidet beskrivelse: | Relay Socket DIN Rail |
| Beskrivelse: | SOCKET DINRAIL W/SCREW TERM K10 |
| Email: | [email protected] |
Relaterede dele til 27E895
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
27E893 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY DIN RAIL MNT KU | Forespørgsel |
 |
910003 | Weidmuller | RELAY SOCKET 24VDC 8PIN OCTAL | Forespørgsel |
 |
27E894 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKETS RAIL MOUNT | Forespørgsel |
 |
2980432 | Phoenix Contact | PLC-HC BASIC TERM BLOCK 120V | Forespørgsel |
 |
2-1416100-5 | TE Connectivity Potter & Brumfield Relays | ST4FTP0 | Forespørgsel |
 |
SFS4-PS | Panasonic Industrial Automation Sales | SOCKET RELAY PCB FOR 4P SF | Forespørgsel |
 |
27E892 | TE Connectivity Potter & Brumfield Relays | SOCKET DIN RAIL MT KRPA SERIES | Forespørgsel |
 |
RSE120152-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
 |
27E891 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY 8 OCTAL DIN RAIL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers