Købe 282435-2 med BYCHPS
Køb med garanti
282435-2
- Varenummer:
- 282435-2
- Beskrivelse:
- RELAY HSG.W.SEC.LOCK.ASSY9 POS
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14030 Pieces
- Datablad:
- 1.282435-2.pdf2.282435-2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 282435-2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 282435-2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 282435-2 |
| Udvidet beskrivelse: | Relay |
| Beskrivelse: | RELAY HSG.W.SEC.LOCK.ASSY9 POS |
| Email: | [email protected] |
Relaterede dele til 282435-2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
JW1-SS | Panasonic Electric Works | SOCKET PLUG IN FOR JW1 RELAYS | Forespørgsel |
 |
282435-1 | TE Connectivity Potter & Brumfield Relays | RELAY HSG.W.SEC.LOCK.ASSY9 POS | Forespørgsel |
 |
M12883/52-001 | Amphenol PCD | CONN BACKSHELL | Forespørgsel |
|
RSL116079-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
|
JRS200300 | Amphenol PCD | QUICK MOUNT, 2 POLE | Forespørgsel |
 |
27E893 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY DIN RAIL MNT KU | Forespørgsel |
 |
7760056107 | Weidmuller | FS 4CO DRM SOCKET | Forespørgsel |
|
154746-2 | TE Connectivity Potter & Brumfield Relays | RELAY BASE HOUSING BLACK | Forespørgsel |
 |
5521814 | Phoenix Contact | RELAY SOCKET | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers