Købe 2912484 med BYCHPS
Køb med garanti
2912484
- Varenummer:
- 2912484
- Fabrikant:
- Phoenix Contact
- Beskrivelse:
- 14 MM PLC BASIC TERM BLOCK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16920 Pieces
- Datablad:
- 2912484.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 2912484, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 2912484 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Screwless Clamp |
| Serie: | PLC-BSP |
| Andre navne: | PLC-BSP-230UC/21-21 PLCBSP230UC2121 |
| Antal positioner: | - |
| Monteringstype: | DIN Rail |
| Fabrikantens standard ledetid: | 3 Weeks |
| Producentens varenummer: | 2912484 |
| Til brug med / relaterede produkter: | Miniature Relays |
| Funktioner: | - |
| Udvidet beskrivelse: | Relay Socket DIN Rail |
| Beskrivelse: | 14 MM PLC BASIC TERM BLOCK |
| Email: | [email protected] |
Relaterede dele til 2912484
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
1-1904045-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOUSING ISO | Forespørgsel |
 |
2912439 | Phoenix Contact | 14 MM PLC BASIC TERM BLOCKS | Forespørgsel |
 |
2912426 | Phoenix Contact | PLC-BSP- 12DC/21-21 | Forespørgsel |
 |
3-1904045-3 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A010-EV-311 | Forespørgsel |
 |
2912497 | Phoenix Contact | RELAY GEN PURPOSE DPDT 6A 12V | Forespørgsel |
 |
2-1904045-4 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A041-EV-100 | Forespørgsel |
|
2912471 | Phoenix Contact | TERM BLOCK | Forespørgsel |
|
2912413 | Phoenix Contact | 14MM PLC BASIC TERM BLOCK 24VDC | Forespørgsel |
|
2912442 | Phoenix Contact | TERM BLOCK | Forespørgsel |
|
2912400 | Phoenix Contact | 14MM PLC BASIC TERM BLOCK 24V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers