Købe 2946719 med BYCHPS
Køb med garanti
2946719
- Varenummer:
- 2946719
- Fabrikant:
- Phoenix Contact
- Beskrivelse:
- RELAY MODULE WITH PLUG-IN BASE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13654 Pieces
- Datablad:
- 2946719.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 2946719, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 2946719 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Screw Terminal |
| Serie: | - |
| Andre navne: | EMG37-RELS/K2-G24 EMG37RELSK2G24 |
| Antal positioner: | - |
| Monteringstype: | DIN Rail |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 2946719 |
| Til brug med / relaterede produkter: | - |
| Funktioner: | Diode, LED Indicator |
| Udvidet beskrivelse: | Relay Socket DIN Rail |
| Beskrivelse: | RELAY MODULE WITH PLUG-IN BASE |
| Email: | [email protected] |
Relaterede dele til 2946719
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2946793 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
 |
RSE112044-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
|
2946722 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
|
2946780 | Phoenix Contact | INPUT OPTOPTOCOUPLER 5VDC | Forespørgsel |
|
2946777 | Phoenix Contact | RELAY MODULE WITH PLUG-IN BASE | Forespørgsel |
|
2946706 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
 |
2972673 | Phoenix Contact | INTERFACE MODULE W PLUG-IN SKT | Forespørgsel |
 |
PY14QN | Omron Automation and Safety | RELAY SOCKET BACK CONNECTING | Forespørgsel |
 |
SP2-SS | Panasonic Electric Works | SOCKET SOLDERING FOR SP2 RELAY | Forespørgsel |
|
2946735 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers