Købe 2950734 med BYCHPS
Køb med garanti
2950734
- Varenummer:
- 2950734
- Fabrikant:
- Phoenix Contact
- Beskrivelse:
- RELAY MODULE WITH PLUG-IN BASE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12167 Pieces
- Datablad:
- 2950734.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 2950734, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 2950734 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Screw Terminal |
| Serie: | - |
| Andre navne: | EMG45-RELS/K2-G220 EMG45RELSK2G220 |
| Antal positioner: | - |
| Monteringstype: | DIN Rail |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 2950734 |
| Til brug med / relaterede produkter: | - |
| Funktioner: | Diode, LED Indicator |
| Udvidet beskrivelse: | Relay Socket DIN Rail |
| Beskrivelse: | RELAY MODULE WITH PLUG-IN BASE |
| Email: | [email protected] |
Relaterede dele til 2950734
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
P7SA-14F-ND DC110 | Omron Automation and Safety | P7SA-14F-ND DC110 | Forespørgsel |
 |
RSE116185-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
|
RSE112064 | Amphenol PCD | LOW PROFILE, 3 POLE/25 AMP, LC | Forespørgsel |
|
RSL112214 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørgsel |
 |
2950763 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
|
2950718 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
|
JRS200301 | Amphenol PCD | QUICK MOUNT, 2 POLE WC | Forespørgsel |
|
RSL116089-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørgsel |
|
2950721 | Phoenix Contact | RELAY GEN PURPOSE | Forespørgsel |
 |
PTF11A | Omron Automation and Safety | RELAY SOCKET DIN MNT FOR LY SER | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers