Købe 2A1634-2 med BYCHPS
Køb med garanti
2A1634-2
- Varenummer:
- 2A1634-2
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- NEUTRAL 400A UNBONDED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15609 Pieces
- Datablad:
- 2A1634-2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 2A1634-2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 2A1634-2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 5 Weeks |
| Producentens varenummer: | 2A1634-2 |
| Beskrivelse: | NEUTRAL 400A UNBONDED |
| Email: | [email protected] |
Relaterede dele til 2A1634-2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2A1634-1 | Eaton | NEUTRAL 200A UNBONDED | Forespørgsel |
|
2A1630-10 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1634-3 | Eaton | NEUTRAL 200A BONDED | Forespørgsel |
|
2A1630-4 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1634-4 | Eaton | NEUTRAL 400A BONDED | Forespørgsel |
|
2A1630-12 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1634-6 | Eaton | NEUTRAL 800A BONDED | Forespørgsel |
|
2A1630-8 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1630-1 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1630-3 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1634-5 | Eaton | NEUTRAL 800A UNBONDED | Forespørgsel |
|
2A1630-2 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1630-14 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1630-13 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
|
2A1630-6 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers