Købe 335HC5750KR med BYCHPS
Køb med garanti
335HC5750KR
- Varenummer:
- 335HC5750KR
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP FILM 3.3UF 10% 750VAC AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15013 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 335HC5750KR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 335HC5750KR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 750V |
| Tolerance: | ±10% |
| Afslutning: | Screw Terminals |
| Størrelse / Dimension: | 3.150" Dia (80.00mm) |
| Serie: | HC5 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | 335HC5750KR |
| Blyafstand: | - |
| Højde - Siddende (Max): | 2.819" (71.60mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 3.3µF ±10% Film Capacitor 750V Polypropylene (PP) Axial |
| ESR (Equivalent Series Resistance): | 1 mOhm |
| Dielektrisk materiale: | Polypropylene (PP) |
| Beskrivelse: | CAP FILM 3.3UF 10% 750VAC AXIAL |
| kapacitans: | 3.3µF |
| Applikationer: | Conduction Cooled; High Pulse, DV/DT |
| Email: | [email protected] |
Relaterede dele til 335HC5750KR
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers