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3530ECBCAMERCURY
- Varenummer:
- 3530ECBCAMERCURY
- Fabrikant:
- Beskrivelse:
- IC PROCESSOR APPL SPEC 515FCBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15424 Pieces
- Datablad:
- 3530ECBCAMERCURY.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 3530ECBCAMERCURY, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 3530ECBCAMERCURY via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Leverandør Device Package: | - |
|---|---|
| Serie: | * |
| Pakke / tilfælde: | - |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | 3530ECBCAMERCURY |
| Udvidet beskrivelse: | Microprocessor IC * |
| Beskrivelse: | IC PROCESSOR APPL SPEC 515FCBGA |
| Email: | [email protected] |
Relaterede dele til 3530ECBCAMERCURY
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
P1020NXE2FFB | NXP USA Inc. | IC MPU Q OR IQ 800MHZ 689TEBGA | Forespørgsel |
 |
MPC8270ZUUPEA | NXP USA Inc. | IC MPU MPC82XX 450MHZ 408TBGA | Forespørgsel |
 |
P2040NSE7HLC | NXP USA Inc. | IC MPU Q OR IQ 1.2GHZ 780FCBGA | Forespørgsel |
 |
MPC8347EZQAGD | NXP USA Inc. | IC MPU MPC83XX 400MHZ 620BGA | Forespørgsel |
|
KMPC8343EZQAGD | NXP USA Inc. | IC MPU MPC83XX 400MHZ 620BGA | Forespørgsel |
 |
MPC8360ECVVADDH | NXP USA Inc. | IC MPU MPC83XX 266MHZ 740TBGA | Forespørgsel |
 |
MPC755CRX350LE | NXP USA Inc. | IC MPU MPC7XX 350MHZ 360FCCBGA | Forespørgsel |
 |
EP7311-CB | Cirrus Logic Inc. | IC MPU EP7 74MHZ 256BGA | Forespørgsel |
|
XAM1707BZKBD4 | Texas Instruments | IC MPU SITARA 456MHZ 256BGA | Forespørgsel |
 |
Z8S18020VSC | Zilog | IC MPU Z180 20MHZ 68PLCC | Forespørgsel |
 |
Z84C0010FEC00TR | Zilog | IC MPU Z80 10MHZ 44QFP | Forespørgsel |
 |
MPC8544EAVTAQGA | NXP USA Inc. | IC MPU MPC85XX 1.0GHZ 783FCBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers