Købe 450USH270MEFC22X50 med BYCHPS
Køb med garanti
450USH270MEFC22X50
- Varenummer:
- 450USH270MEFC22X50
- Fabrikant:
- Rubycon
- Beskrivelse:
- SNAP TERMINAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17795 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 450USH270MEFC22X50, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 450USH270MEFC22X50 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 450USH270MEFC22X50 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SNAP TERMINAL |
| Email: | [email protected] |
Relaterede dele til 450USH270MEFC22X50
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
450USH270MEFCSN25X35 | Rubycon | CAP ALUM 270UF 20% 450V SNAP | Forespørgsel |
|
450USH820MEFC35X50 | Rubycon | CAP ALUM 820UF 20% 450V SNAP | Forespørgsel |
|
450USH330MEFC30X30 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Forespørgsel |
|
450USH270MEFC25X35 | Rubycon | CAP ALUM 270UF 20% 450V SNAP | Forespørgsel |
 |
B43231B5686M | EPCOS (TDK) | CAP ALUM 68UF 20% 450V SNAP | Forespørgsel |
|
450USH330MEFCSN30X30 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Forespørgsel |
 |
860160481038 | Wurth Electronics Inc. | CAP 3300 UF 20% 25 V | Forespørgsel |
|
450USH220MEFC25X30 | Rubycon | CAP ALUM 220UF 20% 450V SNAP | Forespørgsel |
|
450USH120MEFC22X25 | Rubycon | CAP ALUM 120UF 20% 450V SNAP | Forespørgsel |
|
450USH470MEFC35X35 | Rubycon | SNAP TERMINAL | Forespørgsel |
|
450USH180MEFC25X25 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørgsel |
|
450USH330MEFC25X40 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers