Købe 550C372T500DP2B med BYCHPS
Køb med garanti
550C372T500DP2B
- Varenummer:
- 550C372T500DP2B
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP ALUM 3700UF 500V SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18210 Pieces
- Datablad:
- 550C372T500DP2B.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 550C372T500DP2B, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 550C372T500DP2B via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 500V |
|---|---|
| Tolerance: | -10%, +50% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 3.000" Dia (76.20mm) |
| Serie: | 550C |
| Ripple Current: | 16.8A @ 120Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Screw Terminals |
| Andre navne: | 338-1768 |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 550C372T500DP2B |
| Levetid @ Temp.: | 10000 Hrs @ 105°C |
| Blyafstand: | 1.250" (31.75mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 5.875" (149.23mm) |
| Udvidet beskrivelse: | 3700µF 500V Aluminum Capacitors Radial, Can - Screw Terminals 32.4 mOhm 10000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 32.4 mOhm |
| Beskrivelse: | CAP ALUM 3700UF 500V SCREW |
| kapacitans: | 3700µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 550C372T500DP2B
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers