Købe 5962F1120202QXA med BYCHPS
Køb med garanti
5962F1120202QXA
- Varenummer:
- 5962F1120202QXA
- Fabrikant:
- Cypress Semiconductor
- Beskrivelse:
- IC SRAM SYNC 165CGA
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 14006 Pieces
- Datablad:
- 5962F1120202QXA.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 5962F1120202QXA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 5962F1120202QXA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Device Package: | 165-CCGA (21x25) |
| Fart: | 250MHz |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 165-BFCPGA |
| Driftstemperatur: | -55°C ~ 125°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Volatile |
| Hukommelsesstørrelse: | 72Mb (2M x 36) |
| Hukommelsesformat: | SRAM |
| Producentens varenummer: | 5962F1120202QXA |
| grænseflade: | Parallel |
| Beskrivelse: | IC SRAM SYNC 165CGA |
| Email: | [email protected] |
Relaterede dele til 5962F1120202QXA
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
5962F1120101VXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120202VXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120102QXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120101QXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120201VXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120201QXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1120102VXA | Cypress Semiconductor Corp | IC SRAM SYNC 165CGA | Forespørgsel |
|
5962F1123501VXA | Cypress Semiconductor Corp | IC SRAM ASYNC 36CERPAK | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers