Købe 70V7339S133BFI8 med BYCHPS
Køb med garanti
70V7339S133BFI8
- Varenummer:
- 70V7339S133BFI8
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC SRAM 9MBIT 133MHZ 208CABGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 19353 Pieces
- Datablad:
- 70V7339S133BFI8.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 70V7339S133BFI8, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 70V7339S133BFI8 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.15 V ~ 3.45 V |
|---|---|
| Leverandør Device Package: | 208-CABGA (15x15) |
| Fart: | 133MHz |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 208-LFBGA |
| Andre navne: | IDT70V7339S133BFI8 IDT70V7339S133BFI8-ND |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Volatile |
| Hukommelsesstørrelse: | 9Mb (512K x 18) |
| Hukommelsesformat: | SRAM |
| Fabrikantens standard ledetid: | 7 Weeks |
| Producentens varenummer: | 70V7339S133BFI8 |
| grænseflade: | Parallel |
| Beskrivelse: | IC SRAM 9MBIT 133MHZ 208CABGA |
| Email: | [email protected] |
Relaterede dele til 70V7339S133BFI8
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers