Købe 784776233 med BYCHPS
Køb med garanti
784776233
- Varenummer:
- 784776233
- Fabrikant:
- Wurth Electronics
- Beskrivelse:
- FIXED IND 330UH 520MA 1.15 OHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17639 Pieces
- Datablad:
- 1.784776233.pdf2.784776233.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 784776233, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 784776233 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 1054 |
| Størrelse / Dimension: | 0.394" L x 0.354" W (10.00mm x 9.00mm) |
| Afskærmning: | Unshielded |
| Serie: | WE-PD2A |
| Vurderinger: | AEC-Q200 |
| Q @ Freq: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Nonstandard |
| Andre navne: | 732-6899-2 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 784776233 |
| selvinduktion: | 330µH |
| Højde - Siddende (Max): | 0.232" (5.90mm) |
| Frekvens - Test: | 10kHz |
| Frekvens - Selvresonans: | 4MHz |
| Udvidet beskrivelse: | 330µH Unshielded Wirewound Inductor 520mA 1.15 Ohm Max Nonstandard |
| Beskrivelse: | FIXED IND 330UH 520MA 1.15 OHM |
| DC-resistens (DCR): | 1.15 Ohm Max |
| Nuværende vurdering: | 520mA |
| Nuværende - Mætning: | 590mA |
| Email: | [email protected] |
Relaterede dele til 784776233
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers