Købe 807DCR2R3S4EK med BYCHPS
Køb med garanti
807DCR2R3S4EK
- Varenummer:
- 807DCR2R3S4EK
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP 800F -20%, +50% 2.3V TH
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18299 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 807DCR2R3S4EK, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 807DCR2R3S4EK via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.3V |
|---|---|
| Tolerance: | -20%, +50% |
| Afslutning: | - |
| Størrelse / Dimension: | 1.378" Dia (35.00mm) |
| Serie: | DCR |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In - 4 Lead |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 807DCR2R3S4EK |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Blyafstand: | 0.886" (22.50mm) |
| Højde - Siddende (Max): | 2.835" (72.00mm) |
| Udvidet beskrivelse: | 800F -20%, +50%(EDLC) Supercapacitor 2.3V Radial, Can - Snap-In - 4 Lead 10 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 10 mOhm @ 1kHz |
| Beskrivelse: | CAP 800F -20%, +50% 2.3V TH |
| kapacitans: | 800F |
| Email: | [email protected] |
Relaterede dele til 807DCR2R3S4EK
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EEC-SE0H104 | Panasonic Electronic Components | CAP 100MF -20% +80% 5.5V T/H | Forespørgsel |
 |
ESHSP-5000C0-002R7 | NessCap Co Ltd | CAP 5000F 0% +20% 2.7V CHAS MNT | Forespørgsel |
 |
106DER2R5SGW | Illinois Capacitor | CAP 10F -20%, +50% 2.5V T/H | Forespørgsel |
 |
ESHSR-0100C0-002R7 | NessCap Co Ltd | CAP 100F -10% +20% 2.7V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers