Købe ADSP-21469BBC-3 med BYCHPS
Køb med garanti
ADSP-21469BBC-3
- Varenummer:
- ADSP-21469BBC-3
- Fabrikant:
- AD
- Beskrivelse:
- IC DSP 32/40BIT 400MHZ 324CSBGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 14641 Pieces
- Datablad:
- ADSP-21469BBC-3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADSP-21469BBC-3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADSP-21469BBC-3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - I / O: | 3.30V |
|---|---|
| Spænding - Core: | 1.05V |
| Type: | Floating Point |
| Leverandør Device Package: | 324-CSPBGA (19x19) |
| Serie: | SHARC® |
| Emballage: | Tray |
| Pakke / tilfælde: | 324-BGA, CSPBGA |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| On-chip RAM: | 5Mbit |
| Ikke-flygtig hukommelse: | External |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | ADSP-21469BBC-3 |
| grænseflade: | DAI, DPI, EBI/EMI, I²C, SCI, SPI, SSP, UART/USART |
| Beskrivelse: | IC DSP 32/40BIT 400MHZ 324CSBGA |
| Clock Rate: | 400MHz |
| Email: | [email protected] |
Relaterede dele til ADSP-21469BBC-3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers