Købe ADT7485AARMZ-REEL7 med BYCHPS
Køb med garanti
ADT7485AARMZ-REEL7
- Varenummer:
- ADT7485AARMZ-REEL7
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC TEMP/VOLT DGL SENS SST 10MSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12529 Pieces
- Datablad:
- ADT7485AARMZ-REEL7.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADT7485AARMZ-REEL7, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADT7485AARMZ-REEL7 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Topologi: | ADC, Multiplexer, Register Bank |
| Leverandør Device Package: | 10-MSOP |
| Serie: | - |
| Sensortype: | Internal and External |
| Sensing Temperatur: | -40°C ~ 125°C, External Sensor |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| Output Type: | Simple Serial Transport™ (SST) |
| Output Fan: | No |
| Output Alarm: | No |
| Andre navne: | ADT7485AARMZ-REEL7TR |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ADT7485AARMZ-REEL7 |
| Fungere: | Temp Monitoring System (Sensor) |
| Udvidet beskrivelse: | Temp Monitoring System (Sensor) -40°C ~ 125°C, External Sensor Internal and External Sensor Simple Serial Transport™ (SST) Output 10-MSOP |
| Beskrivelse: | IC TEMP/VOLT DGL SENS SST 10MSOP |
| Nøjagtighed: | ±1.75°C(Max) |
| Email: | [email protected] |
Relaterede dele til ADT7485AARMZ-REEL7
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers