Købe ALS71C274QW063 med BYCHPS
Køb med garanti
ALS71C274QW063
- Varenummer:
- ALS71C274QW063
- Fabrikant:
- KEMET
- Beskrivelse:
- ALU SCREW TERMINAL 270000UF 63V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17026 Pieces
- Datablad:
- ALS71C274QW063.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ALS71C274QW063, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ALS71C274QW063 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | ALS71C274QW063 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | ALU SCREW TERMINAL 270000UF 63V |
| Email: | [email protected] |
Relaterede dele til ALS71C274QW063
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ALS71C274QC025 | KEMET | ALU SCREW TERMINAL 270000UF 25V | Forespørgsel |
|
ALS71C274NJ040 | KEMET | ALU SCREW TERMINAL 270000UF 40V | Forespørgsel |
|
ALS71C243QM200 | KEMET | ALU SCREW TERMINAL 24000UF 200V | Forespørgsel |
|
ALS71C274NF040 | KEMET | ALU SCREW TERMINAL 270000UF 40V | Forespørgsel |
|
ALS71C272MF550 | KEMET | ALU SCREW TERMINAL 2700UF 550V | Forespørgsel |
|
ALS71C274NT063 | KEMET | ALU SCREW TERMINAL 270000UF 63V | Forespørgsel |
|
ALS71C272LM550 | KEMET | ALU SCREW TERMINAL 2700UF 550V | Forespørgsel |
|
ALS71C273NT250 | KEMET | ALU SCREW TERMINAL 27000UF 250V | Forespørgsel |
|
ALS71C243QT350 | KEMET | ALU SCREW TERMINAL 24000UF 350V | Forespørgsel |
|
ALS71C273QW250 | KEMET | ALU SCREW TERMINAL 27000UF 250V | Forespørgsel |
|
ALS71C272QC500 | KEMET | ALU SCREW TERMINAL 2700UF 500V | Forespørgsel |
|
ALS71C273NW200 | KEMET | ALU SCREW TERMINAL 27000UF 200V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers