Købe APSA6R3ELL221MFA5G med BYCHPS
Køb med garanti
APSA6R3ELL221MFA5G
- Varenummer:
- APSA6R3ELL221MFA5G
- Fabrikant:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM POLY 220UF 20% 6.3V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18969 Pieces
- Datablad:
- APSA6R3ELL221MFA5G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for APSA6R3ELL221MFA5G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til APSA6R3ELL221MFA5G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 6.3V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 0.248" Dia (6.30mm) |
| Serie: | NPCAP™-PSA |
| Ripple Current - Lavfrekvens: | - |
| Ripple Current - High Frequency: | 3.16A @ 100kHz |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 565-3062 APSA6R3ELL221MF9JG PSA6.3VB220MF11 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | APSA6R3ELL221MFA5G |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Blyafstand: | 0.098" (2.50mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 0.413" (10.50mm) |
| Udvidet beskrivelse: | 220µF ±20% 6.3V Aluminum Polymer Capacitor Radial, Can 20 mOhm 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 20 mOhm |
| Beskrivelse: | CAP ALUM POLY 220UF 20% 6.3V T/H |
| kapacitans: | 220µF |
| Applikationer: | - |
| Email: | [email protected] |
Relaterede dele til APSA6R3ELL221MFA5G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers