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B32529D5225J
- Varenummer:
- B32529D5225J
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 2.2UF 5% 50VDC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13242 Pieces
- Datablad:
- B32529D5225J.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | 50V |
|---|---|
| Spændingsbedømmelse - AC: | 32V |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.307" L x 0.307" W (7.80mm x 7.80mm) |
| Serie: | B32529 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 495-1089 B32529D5225J000 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B32529D5225J |
| Blyafstand: | 0.197" (5.00mm) |
| Højde - Siddende (Max): | 0.512" (13.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 2.2µF ±5% Film Capacitor 32V 50V Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked |
| Beskrivelse: | CAP FILM 2.2UF 5% 50VDC RADIAL |
| kapacitans: | 2.2µF |
| Applikationer: | Automotive; EMI, RFI Suppression |
| Email: | [email protected] |
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B32529D5335K189 | EPCOS (TDK) | CAP FILM 3.3UF 10% 50VDC RADIAL | Forespørgsel |
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B32529D5335M000 | EPCOS (TDK) | CAP FILM 3.3UF 20% 50VDC RADIAL | Forespørgsel |
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B32529D5335M189 | EPCOS (TDK) | CAP FILM 3.3UF 20% 50VDC RADIAL | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers