Købe BAP55L,315 med BYCHPS
Køb med garanti
BAP55L,315
- Varenummer:
- BAP55L,315
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- DIODE PIN 50V 100MA SOD-882
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16124 Pieces
- Datablad:
- BAP55L,315.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BAP55L,315, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BAP55L,315 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Peak Reverse (Max): | 50V |
|---|---|
| Leverandør Device Package: | DFN1006-2 |
| Serie: | - |
| Modstand @ Hvis, F: | 700 mOhm @ 100mA, 100MHz |
| Power Dissipation (Max): | 500mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SOD-882 |
| Andre navne: | 568-1925-2 934058521315 BAP55L T/R |
| Driftstemperatur: | -65°C ~ 150°C (TJ) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BAP55L,315 |
| Udvidet beskrivelse: | RF Diode PIN - Single 50V 100mA 500mW DFN1006-2 |
| Diodetype: | PIN - Single |
| Beskrivelse: | DIODE PIN 50V 100MA SOD-882 |
| Nuværende - Maks: | 100mA |
| Kapacitans @ Vr, F: | 0.28pF @ 20V, 1MHz |
| Email: | [email protected] |
Relaterede dele til BAP55L,315
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BAP55LX,315 | NXP USA Inc. | DIODE SILICON PIN SOD-882D | Forespørgsel |
 |
BAR 88-02V E6127 | Infineon Technologies | DIODE PIN SGL 80V 100MA SC-79 | Forespørgsel |
 |
HSMS-2855-TR1G | Broadcom Limited | DIODE SCHOTTKY DETECT SS SOT-143 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers