Købe BAW101E6327HTSA1 med BYCHPS
Køb med garanti
BAW101E6327HTSA1
- Varenummer:
- BAW101E6327HTSA1
- Beskrivelse:
- DIODE ARRAY GP 300V 250MA SOT143
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15066 Pieces
- Datablad:
- BAW101E6327HTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BAW101E6327HTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BAW101E6327HTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.3V @ 100mA |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 300V |
| Leverandør Device Package: | PG-SOT143-4 |
| Fart: | Standard Recovery >500ns, > 200mA (Io) |
| Serie: | - |
| Reverse Recovery Time (trr): | 1µs |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-253-4, TO-253AA |
| Andre navne: | BAW 101 E6327 BAW 101 E6327-ND BAW101E6327BTSA1 BAW101E6327INTR BAW101E6327INTR-ND BAW101E6327XT SP000010363 |
| Driftstemperatur - Junction: | 150°C (Max) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BAW101E6327HTSA1 |
| Udvidet beskrivelse: | Diode Array 2 Independent Standard 300V 250mA (DC) Surface Mount TO-253-4, TO-253AA |
| Diodetype: | Standard |
| Diode Konfiguration: | 2 Independent |
| Beskrivelse: | DIODE ARRAY GP 300V 250MA SOT143 |
| Nuværende - Reverse Lækage @ Vr: | 150nA @ 250V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 250mA (DC) |
| Email: | [email protected] |
Relaterede dele til BAW101E6327HTSA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers