Købe BGT60E6327XTSA1 med BYCHPS
Køb med garanti
BGT60E6327XTSA1
- Varenummer:
- BGT60E6327XTSA1
- Beskrivelse:
- IC V-BAND RADIO EWLC SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18840 Pieces
- Datablad:
- BGT60E6327XTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BGT60E6327XTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BGT60E6327XTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | - |
|---|---|
| Leverandør Device Package: | PG-WFWLB-119 |
| Serie: | - |
| Power (Watts): | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 119-WFBGA |
| Andre navne: | BGT60E6327XTSA1TR SP001267806 |
| Driftstemperatur: | - |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BGT60E6327XTSA1 |
| grænseflade: | - |
| Inkluderer: | - |
| Fungere: | Transceiver |
| Udvidet beskrivelse: | Telecom IC Transceiver PG-WFWLB-119 |
| Beskrivelse: | IC V-BAND RADIO EWLC SMD |
| Nuværende - Forsyning: | 1 ~ 4mA |
| Email: | [email protected] |
Relaterede dele til BGT60E6327XTSA1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
LE79128KVCT | Microsemi Corporation | IC VOICE LINE VCPNG 128CH 128TQF | Forespørgsel |
 |
SI32176-B-GMR | Silicon Labs | IC PROSLIC FXS -110V 42QFN | Forespørgsel |
 |
DS2187 | Maxim Integrated | IC RECEIVE LINE INTERFACE 18-DIP | Forespørgsel |
 |
CPC7584MC | IXYS Integrated Circuits Division | IC SWITCH LINE CARD ACC 16MLP | Forespørgsel |
|
LE88136BLCT | Microsemi Corporation | IC VOICEPORT 1CH FXS 8KHZ 44LQFP | Forespørgsel |
 |
TP3406N/NOPB | Texas Instruments | IC ADAPTER DIG QDASL QUAD 20PLCC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers