Købe BU7625MUV-E2 med BYCHPS
Køb med garanti
BU7625MUV-E2
- Varenummer:
- BU7625MUV-E2
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC AUDIO VIDEO DRIVER VQFNV5050
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15554 Pieces
- Datablad:
- BU7625MUV-E2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BU7625MUV-E2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BU7625MUV-E2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Video Driver |
|---|---|
| Leverandør Device Package: | - |
| Serie: | - |
| Emballage: | - |
| Pakke / tilfælde: | - |
| Andre navne: | BU7625MUVE2 |
| Monteringstype: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | BU7625MUV-E2 |
| Beskrivelse: | IC AUDIO VIDEO DRIVER VQFNV5050 |
| Applikationer: | Video |
| Email: | [email protected] |
Relaterede dele til BU7625MUV-E2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BU7620MUV-E2 | Rohm Semiconductor | IC AUDIO VIDEO DRIVER VQFN | Forespørgsel |
 |
BU7625GUW-E2 | Rohm Semiconductor | IC AUDIO VIDEO DRIVER 35VBGA | Forespørgsel |
 |
ADV7180WBCPZ | Analog Devices Inc. | IC VIDEO DECODER SDTV 40LFCSP | Forespørgsel |
|
LMH0356SQE/NOPB | Texas Instruments | IC RECLOCKER SDI HD/SD 48WQFN | Forespørgsel |
 |
IP4772CZ16,118 | NXP USA Inc. | IC VGA INTERFACE 16-SSOP | Forespørgsel |
|
VSP1221PFBG4 | Texas Instruments | IC CCD SIGNAL PROCESSOR 48TQFP | Forespørgsel |
|
LMH0026MHX/NOPB | Texas Instruments | IC RECLOCKER SDI HD/SD 20-TSSOP | Forespørgsel |
|
BU76210GU-E2 | Rohm Semiconductor | IC AUDIO VIDEO DRIVER VBGA | Forespørgsel |
|
BU7620GUW-E2 | Rohm Semiconductor | IC LSI INTERFACE 35VBGA | Forespørgsel |
 |
TW8823-LA3-GE | Intersil | IC LCD CTRLR 216LQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers