Købe C165LM3VHAFXUMA1 med BYCHPS
Køb med garanti
C165LM3VHAFXUMA1
- Varenummer:
- C165LM3VHAFXUMA1
- Beskrivelse:
- IC MCU 16BIT ROMLESS 100MQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19426 Pieces
- Datablad:
- C165LM3VHAFXUMA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for C165LM3VHAFXUMA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til C165LM3VHAFXUMA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 100-MQFP (14x20) |
| Fart: | 20MHz |
| Serie: | C16xx |
| RAM-størrelse: | 2K x 8 |
| Programhukommelsestype: | ROMless |
| Programhukommelsesstørrelse: | - |
| tilbehør: | POR, PWM, WDT |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 100-BQFP |
| Andre navne: | C165LM3VHAFAUMA1 F165LM3VHAXT SAF-C165-LM 3V HA SAF-C165-LM3VHA SAF-C165-LM3VHAINTR SAF-C165-LM3VHAINTR-ND SAF-C165-LM3VHATR SAF-C165-LM3VHATR-ND SAFC165LM3VHAXT SP000011635 |
| Oscillator Type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 77 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | C165LM3VHAFXUMA1 |
| Udvidet beskrivelse: | C166 C16xx Microcontroller IC 16-Bit 20MHz ROMless 100-MQFP (14x20) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 16BIT ROMLESS 100MQFP |
| Datakonvertere: | - |
| Core Size: | 16-Bit |
| Core Processor: | C166 |
| Connectivity: | EBI/EMI, SPI, UART/USART |
| Email: | [email protected] |
Relaterede dele til C165LM3VHAFXUMA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers