Købe CGA6L2X7R1H105K160AA med BYCHPS
Køb med garanti
CGA6L2X7R1H105K160AA
- Varenummer:
- CGA6L2X7R1H105K160AA
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- CAP CER 1UF 50V X7R 1210
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14670 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGA6L2X7R1H105K160AA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGA6L2X7R1H105K160AA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 50V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.071" (1.80mm) |
| Temperaturkoefficient: | X7R |
| Størrelse / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Serie: | CGA |
| Vurderinger: | AEC-Q200 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1210 (3225 Metric) |
| Andre navne: | 445-5713-2 CGA6L2X7R1H105K CGA6L2X7R1H105KT0Y0N |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | CGA6L2X7R1H105K160AA |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | - |
| Fejlrate: | - |
| Udvidet beskrivelse: | 1µF ±10% 50V Ceramic Capacitor X7R 1210 (3225 Metric) |
| Beskrivelse: | CAP CER 1UF 50V X7R 1210 |
| kapacitans: | 1µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til CGA6L2X7R1H105K160AA
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CGA6L2X7R1H105K160AE | TDK Corporation | CAP CER 1UF 50V X7R 1210 | Forespørgsel |
 |
CGA6L2X7R1H105K160AD | TDK Corporation | CAP CER 1UF 50V X7R 1210 | Forespørgsel |
|
CGA6L2X7R1H105M160AE | TDK Corporation | CAP CER 1UF 50V X7R 1210 | Forespørgsel |
 |
CGA6L2X7R1H105M160AD | TDK Corporation | CAP CER 1UF 50V X7R 1210 | Forespørgsel |
|
CGA6L2X7R1H105M160AA | TDK Corporation | CAP CER 1UF 50V X7R 1210 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers