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CS8190EDWF20
- Varenummer:
- CS8190EDWF20
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC TACH/SPEEDO DRVR PREC 20SOIC
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16081 Pieces
- Datablad:
- CS8190EDWF20.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CS8190EDWF20, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CS8190EDWF20 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Driver |
|---|---|
| Leverandør Device Package: | 20-SOIC |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 20-SOIC (0.295", 7.50mm Width) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CS8190EDWF20 |
| Udvidet beskrivelse: | Driver IC Automotive 20-SOIC |
| Beskrivelse: | IC TACH/SPEEDO DRVR PREC 20SOIC |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til CS8190EDWF20
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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CS8191XNF16 | ON Semiconductor | IC DRVR AIRCORE TACH/SPEED 16DIP | Forespørgsel |
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CS8190EDWF20G | ON Semiconductor | IC TACH/SPEEDO DRVR PREC 20SOIC | Forespørgsel |
|
CS8190ENF16G | ON Semiconductor | IC DRVR AIRCORE TACH/SPEED 16DIP | Forespørgsel |
|
CS8190EDWFR20 | ON Semiconductor | IC DRVR AIRCORE TACH/SPD 20SOIC | Forespørgsel |
|
CS8190EDWFR20G | ON Semiconductor | IC DRVR AIRCORE TACH/SPD 20SOIC | Forespørgsel |
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XCMECH-FFG1517 | Xilinx Inc. | FFG1517 MECHANICAL SAMPLE | Forespørgsel |
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DLPC2607ZVB | Texas Instruments | IC DMD CTRLR DGTL 176DLP | Forespørgsel |
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NBSG16VSMAG | ON Semiconductor | IC RCVR/DRVR SIGE DIFF 16-FCLGA | Forespørgsel |
|
CS8190ENF16 | ON Semiconductor | IC DRVR AIRCORE TACH/SPEED 16DIP | Forespørgsel |
|
CS8191XDWFR20 | ON Semiconductor | IC DRVR AIRCORE TACH/SPD 20SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers