Købe CY7C09389V-9AXI med BYCHPS
Køb med garanti
CY7C09389V-9AXI
- Varenummer:
- CY7C09389V-9AXI
- Fabrikant:
- Cypress Semiconductor
- Beskrivelse:
- IC SRAM 1.152MBIT 9NS 100TQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18101 Pieces
- Datablad:
- CY7C09389V-9AXI.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CY7C09389V-9AXI, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CY7C09389V-9AXI via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 100-TQFP (14x14) |
| Fart: | 67MHz |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 100-LQFP |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Volatile |
| Hukommelsesstørrelse: | 1.152Mb (64K x 18) |
| Hukommelsesformat: | SRAM |
| Producentens varenummer: | CY7C09389V-9AXI |
| grænseflade: | Parallel |
| Beskrivelse: | IC SRAM 1.152MBIT 9NS 100TQFP |
| Email: | [email protected] |
Relaterede dele til CY7C09389V-9AXI
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CY7C09389V-9AXC | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 9NS 100TQFP | Forespørgsel |
|
CY7C09389V-6AXC | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 6.5NS 100TQFP | Forespørgsel |
|
CY7C09389V-7AXC | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 7.5NS 100TQFP | Forespørgsel |
|
CY7C09389V-12AXCT | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 12NS 100TQFP | Forespørgsel |
|
CY7C09389V-9AXCT | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 9NS 100TQFP | Forespørgsel |
|
CY7C09389V-12AXC | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 12NS 100TQFP | Forespørgsel |
|
CY7C09389V-9AI | Cypress Semiconductor Corp | IC SRAM 1.152MBIT 9NS 100TQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers