Købe DLPR910AYVA med BYCHPS
Køb med garanti
DLPR910AYVA
- Varenummer:
- DLPR910AYVA
- Fabrikant:
- Beskrivelse:
- IC CONFIG FOR DLPC910 48DSBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14679 Pieces
- Datablad:
- DLPR910AYVA.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DLPR910AYVA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DLPR910AYVA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Leverandør Device Package: | 48-DSBGA |
|---|---|
| Serie: | * |
| Emballage: | Bulk |
| Pakke / tilfælde: | 48-TFBGA, DSBGA |
| Andre navne: | 296-45337 DLPR910AYVA-ND |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | DLPR910AYVA |
| Udvidet beskrivelse: | IC 48-DSBGA |
| Beskrivelse: | IC CONFIG FOR DLPC910 48DSBGA |
| Email: | [email protected] |
Relaterede dele til DLPR910AYVA
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
DLPR910YVA | Texas Instruments | IC CONFIG FOR DLPC910 48DSBGA | Forespørgsel |
|
DLP3000FQB | Texas Instruments | IC DLP 0.3 WVGA DMD 50LCCC | Forespørgsel |
 |
DS3184 | Maxim Integrated | IC QUAD ATM/PACKET PHY 400BGA | Forespørgsel |
 |
DS2401P | Maxim Integrated | IC SILICON SERIAL NUMBER 6-TSOC | Forespørgsel |
 |
MC68882EI33A | NXP USA Inc. | IC FLOAT-PT COPROC 33MHZ 68PLCC | Forespørgsel |
|
DLPC150ZEZ | Texas Instruments | IC DLP DGTL CTLR 201NFBGA | Forespørgsel |
|
MAX4507CAP+ | Maxim Integrated | IC SIGNAL LINE PROTECTOR 20-SSOP | Forespørgsel |
 |
AT88SA102S-TSU-T | Microchip Technology | IC PROD AUTHENTICATION SOT23-3 | Forespørgsel |
|
HCS512-I/SO | Microchip Technology | IC CODE HOPPING DECODER 18-SOIC | Forespørgsel |
 |
MAX4945AELA+T | Maxim Integrated | IC CTLR OVP W/FET 5.80V 8-UDFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers