Købe DMN65D8LDWQ-13 med BYCHPS
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DMN65D8LDWQ-13
- Varenummer:
- DMN65D8LDWQ-13
- Fabrikant:
- Diodes Incorporated
- Beskrivelse:
- MOSFET 2N-CH 60V 180MA SOT363
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16910 Pieces
- Datablad:
- DMN65D8LDWQ-13.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DMN65D8LDWQ-13, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DMN65D8LDWQ-13 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | DMN65D8LDWQ-13 |
| Udvidet beskrivelse: | Mosfet Array |
| Beskrivelse: | MOSFET 2N-CH 60V 180MA SOT363 |
| Email: | [email protected] |
Relaterede dele til DMN65D8LDWQ-13
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
DMN65D8LQ-7 | Diodes Incorporated | MOSFET N-CH 60V SOT23 | Forespørgsel |
 |
DMN65D8LDW-7 | Diodes Incorporated | MOSFET 2N-CH 60V 0.18A SOT363 | Forespørgsel |
 |
DMN65D8LW-7 | Diodes Incorporated | MOSFET N-CH 60V 0.3A SOT323 | Forespørgsel |
|
DMN65D8L-7 | Diodes Incorporated | MOSFET N-CH 60V 310MA SOT23 | Forespørgsel |
|
DMN65D8LQ-13 | Diodes Incorporated | MOSFET N-CH 60V SOT23 | Forespørgsel |
 |
MCH6604-TL-E | ON Semiconductor | MOSFET 2N-CH 50V 0.25A MCPH6 | Forespørgsel |
 |
DMN65D8LFB-7 | Diodes Incorporated | MOSFET N-CH 60V 260MA 3DFN | Forespørgsel |
 |
DMN65D8LDWQ-7 | Diodes Incorporated | MOSFET 2N-CH 60V 180MA SOT363 | Forespørgsel |
|
DMN65D8LFB-7B | Diodes Incorporated | MOSFET N-CH 60V 260MA 3DFN | Forespørgsel |
 |
IRF7752TR | Infineon Technologies | MOSFET 2N-CH 30V 4.6A 8-TSSOP | Forespørgsel |
 |
NTQD6968NR2 | ON Semiconductor | MOSFET 2N-CH 20V 6.2A 8TSSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers