Købe DS34S132GN+ med BYCHPS
Køb med garanti
DS34S132GN+
- Varenummer:
- DS34S132GN+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC TDM OVER PACKET 676-BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17015 Pieces
- Datablad:
- DS34S132GN+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DS34S132GN+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DS34S132GN+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.8V, 3.3V |
|---|---|
| Leverandør Device Package: | 676-PBGA (27x27) |
| Serie: | - |
| Power (Watts): | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 676-BGA |
| Andre navne: | 90-34S13+2N0 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | DS34S132GN+ |
| grænseflade: | TDMoP |
| Inkluderer: | - |
| Fungere: | TDM-over-Packet (TDMoP) |
| Udvidet beskrivelse: | Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27) |
| Beskrivelse: | IC TDM OVER PACKET 676-BGA |
| Nuværende - Forsyning: | - |
| Email: | [email protected] |
Relaterede dele til DS34S132GN+
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
DS34S132GNA2+ | Maxim Integrated | IC 32PORT TDM OVER PACKET 676BGA | Forespørgsel |
 |
DS34S108GN+ | Maxim Integrated | IC TRANSPORT TDM 484BGA | Forespørgsel |
|
DS34S101GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørgsel |
|
DS34S102GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørgsel |
 |
DS34S101GN+ | Maxim Integrated | IC TRANSPORT TDM SGL 256-CSBGA | Forespørgsel |
 |
DS34S102GN+ | Maxim Integrated | IC TRANSPORT TDM DUAL 256-CSBGA | Forespørgsel |
|
DS34S104GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørgsel |
|
DS34S132GN | Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | Forespørgsel |
 |
DS34S104GN+ | Maxim Integrated | IC TRANSPORT TDM 256CSBGA | Forespørgsel |
|
DS34S108GN | Maxim Integrated | IC TDM/PACKET TRANSPORT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers