Købe DSPIC33EP128GP506T-E/PT med BYCHPS
Køb med garanti
DSPIC33EP128GP506T-E/PT
- Varenummer:
- DSPIC33EP128GP506T-E/PT
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC MCU 16BIT 128KB FLASH 64TQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17765 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for DSPIC33EP128GP506T-E/PT, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DSPIC33EP128GP506T-E/PT via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 64-TQFP (10x10) |
| Fart: | 60 MIPs |
| Serie: | dsPIC™ 33EP |
| RAM-størrelse: | 8K x 16 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 128KB (43K x 24) |
| tilbehør: | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 64-TQFP |
| Oscillator Type: | Internal |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antal I / O: | 53 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | DSPIC33EP128GP506T-E/PT |
| Udvidet beskrivelse: | dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 60 MIPs 128KB (43K x 24) FLASH 64-TQFP (10x10) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 16BIT 128KB FLASH 64TQFP |
| Datakonvertere: | A/D 16x10b/12b |
| Core Size: | 16-Bit |
| Core Processor: | dsPIC |
| Connectivity: | CAN, I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
Relaterede dele til DSPIC33EP128GP506T-E/PT
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers