Købe EPC2024ENG med BYCHPS
Køb med garanti
EPC2024ENG
- Varenummer:
- EPC2024ENG
- Fabrikant:
- EPC
- Beskrivelse:
- TRANS GAN 40V 60A BUMPED DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17492 Pieces
- Datablad:
- EPC2024ENG.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EPC2024ENG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EPC2024ENG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.5V @ 19mA |
|---|---|
| Teknologi: | GaNFET (Gallium Nitride) |
| Leverandør Device Package: | Die |
| Serie: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 1.5 mOhm @ 37A, 5V |
| Power Dissipation (Max): | - |
| Emballage: | Tray |
| Pakke / tilfælde: | Die |
| Andre navne: | 917-EPC2024ENG EPC2024ENGRC3 |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 24 Weeks |
| Producentens varenummer: | EPC2024ENG |
| Inputkapacitans (Ciss) (Max) @ Vds: | 2100pF @ 20V |
| Gate Charge (Qg) (Max) @ Vgs: | 19nC @ 5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 40V 60A (Ta) Surface Mount Die |
| Afløb til Source Voltage (VDSS): | 40V |
| Beskrivelse: | TRANS GAN 40V 60A BUMPED DIE |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 60A (Ta) |
| Email: | [email protected] |
Relaterede dele til EPC2024ENG
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EPC2024ENGR | EPC | TRANS GAN 40V 60A BUMPED DIE | Forespørgsel |
 |
EPC2024 | EPC | MOSFET NCH 40V 60A DIE | Forespørgsel |
|
EPC2023ENG | EPC | TRANS GAN 30V 60A BUMPED DIE | Forespørgsel |
|
EPC2021ENG | EPC | TRANS GAN 80V 60A BUMPED DIE | Forespørgsel |
|
EPC2022ENGRT | EPC | TRANS GAN 100V 60A BUMPED DIE | Forespørgsel |
 |
EPC2029ENGR | EPC | TRANS GAN 80V 31A BUMPED DIE | Forespørgsel |
|
EPC2029 | EPC | TRANS GAN 80V 31A BUMPED DIE | Forespørgsel |
 |
EPC2030ENGRT | EPC | MOSFET NCH 40V 31A DIE | Forespørgsel |
|
EPC2021ENGR | EPC | TRANS GAN 80V 60A BUMPED DIE | Forespørgsel |
|
EPC2029ENGRT | EPC | TRANS GAN 80V 31A BUMPED DIE | Forespørgsel |
|
EPC2023ENGR | EPC | TRANS GAN 30V 60A BUMPED DIE | Forespørgsel |
 |
EPC2025 | EPC | TRANS GAN 300V 150MO BUMPED DIE | Forespørgsel |
|
EPC2025ENGR | EPC | TRANS GAN 300V 4A BUMPED DIE | Forespørgsel |
|
EPC2020ENG | EPC | TRANS GAN 60V 60A BUMPED DIE | Forespørgsel |
|
EPC2021 | EPC | TRANS GAN 80V 90A BUMPED DIE | Forespørgsel |
|
EPC2022 | EPC | TRANS GAN 100V 3MOHM BUMPED DIE | Forespørgsel |
|
EPC2020ENGR | EPC | TRANS GAN 60V 60A BUMPED DIE | Forespørgsel |
|
EPC2020 | EPC | TRANS GAN 60V 90A BUMPED DIE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers