Købe FDD306P med BYCHPS
Køb med garanti
FDD306P
- Varenummer:
- FDD306P
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MOSFET P-CH 12V 6.7A DPAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12472 Pieces
- Datablad:
- FDD306P.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FDD306P, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FDD306P via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 1.5V @ 250µA |
|---|---|
| Vgs (Max): | ±8V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TO-252 |
| Serie: | PowerTrench® |
| Rds On (Max) @ Id, Vgs: | 28 mOhm @ 6.7A, 4.5V |
| Power Dissipation (Max): | 52W (Ta) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navne: | FDD306P-ND FDD306PTR |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | FDD306P |
| Inputkapacitans (Ciss) (Max) @ Vds: | 1290pF @ 6V |
| Gate Charge (Qg) (Max) @ Vgs: | 21nC @ 4.5V |
| FET Type: | P-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | P-Channel 12V 6.7A (Ta) 52W (Ta) Surface Mount TO-252 |
| Drevspænding (Maks. Rds On, Min Rds On): | 1.8V, 4.5V |
| Afløb til Source Voltage (VDSS): | 12V |
| Beskrivelse: | MOSFET P-CH 12V 6.7A DPAK |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 6.7A (Ta) |
| Email: | [email protected] |
Relaterede dele til FDD306P
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers