Købe FJI5603DTU med BYCHPS
Køb med garanti
FJI5603DTU
- Varenummer:
- FJI5603DTU
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- TRANS NPN 800V 3A I2PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18451 Pieces
- Datablad:
- FJI5603DTU.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FJI5603DTU, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FJI5603DTU via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 800V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 2.5V @ 200mA, 1A |
| Transistor Type: | NPN |
| Leverandør Device Package: | I2PAK |
| Serie: | - |
| Strøm - Max: | 100W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | FJI5603DTU |
| Frekvens - Overgang: | 5MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor NPN 800V 3A 5MHz 100W Through Hole I2PAK |
| Beskrivelse: | TRANS NPN 800V 3A I2PAK |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 400mA, 3V |
| Nuværende - Collector Cutoff (Max): | 100µA |
| Nuværende - Samler (Ic) (Max): | 3A |
| Email: | [email protected] |
Relaterede dele til FJI5603DTU
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers