Købe FM31L276-G med BYCHPS
Køb med garanti
FM31L276-G
- Varenummer:
- FM31L276-G
- Fabrikant:
- Cypress Semiconductor
- Beskrivelse:
- IC MEMORY 14SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12875 Pieces
- Datablad:
- FM31L276-G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FM31L276-G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FM31L276-G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Processor Companion |
|---|---|
| Leverandør Device Package: | 14-SOIC |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 14-SOIC (0.154", 3.90mm Width) |
| Andre navne: | 428-3221 FM31L276G |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | FM31L276-G |
| Udvidet beskrivelse: | Processor Companion IC Processor-Based Systems 14-SOIC |
| Beskrivelse: | IC MEMORY 14SOIC |
| Applikationer: | Processor-Based Systems |
| Email: | [email protected] |
Relaterede dele til FM31L276-G
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FM31L278-GTR | Cypress Semiconductor Corp | IC MEMORY 14SOIC | Forespørgsel |
|
FM31L276-GTR | Cypress Semiconductor Corp | IC MEMORY 14SOIC | Forespørgsel |
 |
DLP5500BFYA | Texas Instruments | IC XGA DMD 0.55 149CPGA | Forespørgsel |
|
FM31L278-G | Cypress Semiconductor Corp | IC MEMORY 14SOIC | Forespørgsel |
 |
TLE8261-2E | Infineon Technologies | IC SYSTEM BASIS CHIP DSO-36 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers