Købe FSA2567UMX_F135 med BYCHPS
Køb med garanti
FSA2567UMX_F135
- Varenummer:
- FSA2567UMX_F135
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IC SWITCH 4PDT 16UMLP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14186 Pieces
- Datablad:
- FSA2567UMX_F135.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FSA2567UMX_F135, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FSA2567UMX_F135 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Single (V +): | 1.65 V ~ 4.3 V |
|---|---|
| Spænding - Supply, Dual (V ±): | - |
| Skift kredsløb: | 4PDT |
| Leverandør Device Package: | 16-UMLP (1.8x2.6) |
| Serie: | - |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | 16-UFQFN |
| Andre navne: | FSA2567UMX_F135DKR |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| On-State Resistance (Max): | 10 Ohm |
| Antal kanaler: | 1 |
| Multiplexer / Demultiplexer Circuit: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | FSA2567UMX_F135 |
| Funktioner: | Break-Before-Make |
| Udvidet beskrivelse: | Telecommunications Switch IC 1 Channel 16-UMLP (1.8x2.6) |
| Beskrivelse: | IC SWITCH 4PDT 16UMLP |
| Applikationer: | Telecommunications |
| -3db båndbredde: | 475MHz |
| Email: | [email protected] |
Relaterede dele til FSA2567UMX_F135
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FSA2567UMX | Fairchild/ON Semiconductor | IC SWITCH 4PDT 16UMLP | Forespørgsel |
 |
FSA2567MPX | Fairchild/ON Semiconductor | IC SWITCH 4PDT 16MLP | Forespørgsel |
 |
MAX310CWN | Maxim Integrated | IC VIDEO MULTIPLEXER 8X1 18SOIC | Forespørgsel |
 |
MAX311CPE | Maxim Integrated | IC VIDEO MULTIPLEXER 4X1 16DIP | Forespørgsel |
 |
PI3G612ZHEX | Diodes Incorporated | IC MUX/DEMUX 6CH 1:2 28TQFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers