Købe G6CK-2117P-US-DC12 med BYCHPS
Køb med garanti
G6CK-2117P-US-DC12
- Varenummer:
- G6CK-2117P-US-DC12
- Fabrikant:
- Omron
- Beskrivelse:
- RELAY GEN PURPOSE DPST 8A 12V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19569 Pieces
- Datablad:
- G6CK-2117P-US-DC12.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for G6CK-2117P-US-DC12, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til G6CK-2117P-US-DC12 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 8.4 VDC |
|---|---|
| Sluk spænding (Min): | - |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 250VAC, 125VDC - Max |
| Serie: | G6C |
| Udgivelsestid: | 10ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | G6CK-2117P-USDC12 G6CK1154A G6CK2117PUS12DC G6CK2117PUSDC12 |
| Driftstemperatur: | -25°C ~ 70°C |
| Brug tid: | 10ms |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | G6CK-2117P-US-DC12 |
| Funktioner: | Sealed - Flux Protection |
| Udvidet beskrivelse: | General Purpose Relay DPST-NO/NC (1 Form A and B) 12VDC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE DPST 8A 12V |
| Kontakt Rating (Aktuel): | 8A |
| Kontaktmateriale: | Silver Alloy, Cadmium Free |
| Kontaktformular: | DPST-NO/NC (1 Form A and B) |
| Spole spænding: | 12VDC |
| Spole type: | Latching, Dual Coil |
| Coil Resistance: | 515 Ohms |
| Coil Power: | 280 mW |
| Coil Current: | 23.3mA |
| Email: | [email protected] |
Relaterede dele til G6CK-2117P-US-DC12
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers