Købe GHN23031 med BYCHPS
Køb med garanti
GHN23031
- Varenummer:
- GHN23031
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 0.8-23PF 750V SURF MNT
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16588 Pieces
- Datablad:
- GHN23031.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GHN23031, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GHN23031 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 750V |
|---|---|
| Størrelse / Dimension: | 0.312" Dia x 1.071" L (7.92mm x 27.20mm) |
| Serie: | - |
| Emballage: | Bulk |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GHN23031 |
| Højde - Siddende (Max): | - |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 0.8 ~ 23pF Trimmer Capacitor 750V Top Adjustment Surface Mount |
| Beskrivelse: | CAP TRIM 0.8-23PF 750V SURF MNT |
| Kapacitansområde: | 0.8 ~ 23pF |
| Justeringstype: | Top Adjustment |
| Email: | [email protected] |
Relaterede dele til GHN23031
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GDT20031 | Sprague-Goodman | CAP TRIM 1.5-20PF 250V SURF MNT | Forespørgsel |
|
GMA40600 | Sprague-Goodman | CAP TRIM 105-480PF 175V T/H | Forespørgsel |
|
GHN23033 | Sprague-Goodman | CAP TRIM 0.8-23PF 750V SURF MNT | Forespørgsel |
|
GXR36000 | Sprague-Goodman | CAP TRIM 4.5-36PF 200V THRU HOLE | Forespørgsel |
|
GFR12100 | Sprague-Goodman | CAP TRIMMER TH | Forespørgsel |
 |
0538-011-F-15.0-60 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Forespørgsel |
|
GHN23000 | Sprague-Goodman | CAP TRIM 0.8-23PF 750V THRU HOLE | Forespørgsel |
 |
2807S1R020NHD4BAA | Vishay BC Components | CAP TRIMMER 0.7-20PF 100V SMD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers