Købe GHXS060A120S-D3 med BYCHPS
Køb med garanti
GHXS060A120S-D3
- Varenummer:
- GHXS060A120S-D3
- Fabrikant:
- Global Power Technologies Group
- Beskrivelse:
- MOD SBD BRIDGE 1200V 60A SOT227
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18522 Pieces
- Datablad:
- GHXS060A120S-D3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GHXS060A120S-D3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GHXS060A120S-D3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.7V @ 60A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 1200V (1.2kV) |
| Leverandør Device Package: | SOT-227 |
| Fart: | No Recovery Time > 500mA (Io) |
| Serie: | - |
| Reverse Recovery Time (trr): | 0ns |
| Emballage: | Bulk |
| Pakke / tilfælde: | SOT-227-4, miniBLOC |
| Andre navne: | 1560-1011 1560-1011-ND GHXS060A120SD3 |
| Driftstemperatur - Junction: | -55°C ~ 175°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | GHXS060A120S-D3 |
| Udvidet beskrivelse: | Diode Array 2 Independent Silicon Carbide Schottky 1200V (1.2kV) 60A Chassis Mount SOT-227-4, miniBLOC |
| Diodetype: | Silicon Carbide Schottky |
| Diode Konfiguration: | 2 Independent |
| Beskrivelse: | MOD SBD BRIDGE 1200V 60A SOT227 |
| Nuværende - Reverse Lækage @ Vr: | 200µA @ 1200V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 60A |
| Email: | [email protected] |
Relaterede dele til GHXS060A120S-D3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers