Købe GMD20600 med BYCHPS
Køb med garanti
GMD20600
- Varenummer:
- GMD20600
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 25-115PF 175V THRU HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19137 Pieces
- Datablad:
- GMD20600.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GMD20600, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GMD20600 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 175V |
|---|---|
| Størrelse / Dimension: | 0.531" L x 0.375" W (13.50mm x 9.53mm) |
| Serie: | GMD |
| Emballage: | Bulk |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GMD20600 |
| Højde - Siddende (Max): | 0.720" (18.30mm) |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 25 ~ 115pF Trimmer Capacitor 175V Side Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 25-115PF 175V THRU HOLE |
| Kapacitansområde: | 25 ~ 115pF |
| Justeringstype: | Side Adjustment |
| Email: | [email protected] |
Relaterede dele til GMD20600
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GMD20400 | Sprague-Goodman | CAP TRIM 12-65PF 175V THRU HOLE | Forespørgsel |
 |
0538-073-D-9.0-35 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Forespørgsel |
|
GMD20700 | Sprague-Goodman | CAP TRIM 55-285PF 175V THRU HOLE | Forespørgsel |
|
GMD20000 | Sprague-Goodman | CAP TRIM 2.5-7PF 175V THRU HOLE | Forespørgsel |
|
GMD20200 | Sprague-Goodman | CAP TRIM 4-20PF 175V THRU HOLE | Forespørgsel |
|
GMD20800 | Sprague-Goodman | CAP TRIM 90-340PF 175V THRU HOLE | Forespørgsel |
|
GMD20500 | Sprague-Goodman | CAP TRIM 16-90PF 175V THRU HOLE | Forespørgsel |
|
GMD20300 | Sprague-Goodman | CAP TRIM 8-45PF 175V THRU HOLE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers