Købe GYA27000 med BYCHPS
Køb med garanti
GYA27000
- Varenummer:
- GYA27000
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIMMER 2.3-27PF 100V TH
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19216 Pieces
- Datablad:
- GYA27000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GYA27000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GYA27000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 100V |
|---|---|
| Størrelse / Dimension: | Round - 0.335" Dia (8.50mm) |
| Serie: | FILMTRIM® |
| Emballage: | Bulk |
| Andre navne: | SG3004 |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | GYA27000 |
| Højde - Siddende (Max): | 0.402" (10.20mm) |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 2.3 ~ 27pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIMMER 2.3-27PF 100V TH |
| Kapacitansområde: | 2.3 ~ 27pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Relaterede dele til GYA27000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GSG901 | Sprague-Goodman | CAP TRIM 0.6-14PF 750V PNL MOUNT | Forespørgsel |
|
GYA27002 | Sprague-Goodman | CAP TRIM 2.3-27PF 100V THRU HOLE | Forespørgsel |
|
GEL28000 | Sprague-Goodman | CAP TRIMMER TH | Forespørgsel |
|
GUN1R200 | Sprague-Goodman | CAP TRIM 0.3-1.2PF 500V | Forespørgsel |
 |
CTZ3S-30C-W1-PF | AVX Corporation | CAP TRIMMER 4.5-30PF 25V SMD | Forespørgsel |
 |
SGNMNC3101EK | Sprague-Goodman | CAP TRIM 1-10PF 1.5KV CHASS MNT | Forespørgsel |
 |
SGNMNC1108EK | Sprague-Goodman | CAP TRIM 1-10PF 7.5KV CHASS MNT | Forespørgsel |
 |
TZY2Z010AC01B00 | Murata Electronics North America | CAP TRIMMER 0.5-1PF 25V SMD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers