Købe HA9P5020-5 med BYCHPS
Køb med garanti
HA9P5020-5
- Varenummer:
- HA9P5020-5
- Fabrikant:
- Intersil
- Beskrivelse:
- IC AMP VIDEO 100MHZ CFB 8-SOIC
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15860 Pieces
- Datablad:
- HA9P5020-5.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HA9P5020-5, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HA9P5020-5 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | ±4.5 V ~ 18 V |
|---|---|
| Leverandør Device Package: | 8-SOIC |
| Slew Rate: | 1100 V/µs |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 8-SOIC (0.154", 3.90mm Width) |
| Output Type: | - |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | HA9P5020-5 |
| Beskrivelse: | IC AMP VIDEO 100MHZ CFB 8-SOIC |
| Nuværende - Forsyning: | 7.5mA |
| Nuværende - Output / Channel: | 31.7mA |
| Applikationer: | Current Feedback |
| -3db båndbredde: | 100MHz |
| Email: | [email protected] |
Relaterede dele til HA9P5020-5
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HA9P5020-5ZX96 | Intersil | IC OPAMP CFA 100MHZ 8-SOIC | Forespørgsel |
|
HA9P5002-9 | Intersil | IC OPAMP BUFFER 110MHZ 8SOIC | Forespørgsel |
|
HA9P5002-9Z | Intersil | IC OPAMP BUFFER 110MHZ 8SOIC | Forespørgsel |
|
HA9P5020-5X96 | Intersil | IC OPAMP CFA 110MHZ 8-SOIC | Forespørgsel |
|
HA9P5020-5Z | Intersil | IC AMP VIDEO 100MHZ CFB 8-SOIC | Forespørgsel |
 |
HA9P5320-5 | Intersil | IC OPAMP SAMPLE HOLD 2MHZ 16SOIC | Forespørgsel |
|
HA9P5104-9 | Intersil | IC OPAMP GP 8MHZ 16SOIC | Forespørgsel |
|
HA9P5002-5 | Intersil | IC OPAMP BUFFER 110MHZ 8SOIC | Forespørgsel |
|
HA9P5002-5Z | Intersil | IC OPAMP BUFFER 110MHZ 8SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers