Købe HT506DC med BYCHPS
Køb med garanti
HT506DC
- Varenummer:
- HT506DC
- Beskrivelse:
- IC MUX ANLG 16-CH SINGLE 28-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19800 Pieces
- Datablad:
- HT506DC.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HT506DC, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HT506DC via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Single (V +): | 5V |
|---|---|
| Spænding - Supply, Dual (V ±): | - |
| Skift kredsløb: | - |
| Leverandør Device Package: | 28-CDIP |
| Serie: | HTMOS™ |
| Emballage: | Bulk |
| Pakke / tilfælde: | 28-CDIP (0.600", 15.24mm) |
| Driftstemperatur: | -55°C ~ 225°C (TA) |
| On-State Resistance (Max): | 400 Ohm |
| Antal kanaler: | 1 |
| Multiplexer / Demultiplexer Circuit: | 16:1 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | HT506DC |
| Funktioner: | - |
| Udvidet beskrivelse: | High Temperature Switch IC 1 Channel 28-CDIP |
| Beskrivelse: | IC MUX ANLG 16-CH SINGLE 28-DIP |
| Applikationer: | High Temperature |
| -3db båndbredde: | - |
| Email: | [email protected] |
Relaterede dele til HT506DC
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PI3WVR31313AZLE | Diodes Incorporated | IC MUX/DEMUX 3:1 HDMI 60TQFN | Forespørgsel |
 |
MAX4818ETE+T | Maxim Integrated | IC SWITCH DUAL SPDT 16TQFN | Forespørgsel |
 |
NX3DV221GM,132 | NXP USA Inc. | IC USB 2.0 SWITCH HS 10XQFN | Forespørgsel |
 |
TS3V330RGYR | Texas Instruments | IC MUX/DMUX VIDEO SW QUAD 16-QFN | Forespørgsel |
 |
HV2221FG-G | Microchip Technology | IC 8CH ANALOG SWITCH 48LQFP | Forespørgsel |
 |
HT506 | Honeywell Microelectronics & Precision Sensors | IC MUX ANLG 16-CH SINGLE 28-DIP | Forespørgsel |
 |
PEX8749-CA80BC G | Broadcom Limited | IC PCI EXPRESS SWITCH | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers